HANMI Semiconductor today announced that it has shipped the first “FC Bonder 75” to a customer. Designed for 2.5D AI semiconductor packaging, the new system marks the company’s expansion beyond High ...

The next generation of high-performance AI chips requires new cooling solutions. At Semicon, TRUMPF is showcasing a new ultrashort-pulse laser application that enables, for the first time, the ...

Shanghai Chengwei Semiconductor Equipment Co., Ltd. has officially announced the launch of its latest laboratory central gas supply system.

Singapore unveils SG Semiconductor, a national identity for its semiconductor sector, to raise global visibility and connect companies with its ecosystem and talent.

ACCM's Wisconsin facility will bring online laminate capacity of 20 million square feet per year in January 2027, with build-up and prepreg capacity of 87 million square feet per year online in ...

One energy-efficient architecture scales from a single die to the four-die RAIDEN-X4 flagship, combining configurable power with up to 3.36 PFLOPS of FP4 AI Compute, 256 GB of memory, 1.54 TB/s die-to ...

Expanded partnership spans TSMC A14 certification, silicon-proven IP on TSMC N3P/N2P, wafer-scale 3D-IC for hundreds of chiplets, and agentic AI flows.

Valens Semiconductor, a provider of high-performance connectivity chipsets, today announced a collaboration with onsemi on a cost-optimized integrated sensor for high-volume 3-megapixel automotive ...

New facility expected to expand capacity by approximately CAD $250 million annually, with potential for approximately CAD $400 million upon full site build-out.

IC-Link by imec, imec’s design and manufacturing service provider for ASICs and silicon photonics, and TSMC today announced an expansion of their collaboration aimed at simplifying customer access to ...

Cognex Corporation today announced the launch of the In-Sight 1750 Series, a next-generation wafer and panel identification system designed to help semiconductor manufacturers reduce disruptions, ...

Nexstrom, the semiconductor company building the first wafer-scale platform for 2D semiconductor materials, today announced it has raised a $12 million seed round led by Xora Innovation, with ...