HANMI Semiconductor today announced that it has shipped the first “FC Bonder 75” to a customer. Designed for 2.5D AI semiconductor packaging, the new system marks the company’s expansion beyond High ...

The next generation of high-performance AI chips requires new cooling solutions. At Semicon, TRUMPF is showcasing a new ultrashort-pulse laser application that enables, for the first time, the ...

Shanghai Chengwei Semiconductor Equipment Co., Ltd. has officially announced the launch of its latest laboratory central gas supply system.

Singapore unveils SG Semiconductor, a national identity for its semiconductor sector, to raise global visibility and connect companies with its ecosystem and talent.

Global semiconductor revenue surpassed $425bn in 2Q26 reaching another all-time high as the market grew a record 31.4% ...

ACCM's Wisconsin facility will bring online laminate capacity of 20 million square feet per year in January 2027, with build-up and prepreg capacity of 87 million square feet per year online in ...

One energy-efficient architecture scales from a single die to the four-die RAIDEN-X4 flagship, combining configurable power with up to 3.36 PFLOPS of FP4 AI Compute, 256 GB of memory, 1.54 TB/s die-to ...

Traditional measurement approaches like strain gauges and LVDT displacement sensors are reaching their limits for detecting ...

Expanded partnership spans TSMC A14 certification, silicon-proven IP on TSMC N3P/N2P, wafer-scale 3D-IC for hundreds of chiplets, and agentic AI flows.

NY Creates (the New York Center for Research, Economic Advancement, Technology, Engineering, and Science) and Micron Technology, Inc., held a signing ceremony where 10 apprentices joined the first ...

Cognex Corporation today announced the launch of the In-Sight 1750 Series, a next-generation wafer and panel identification system designed to help semiconductor manufacturers reduce disruptions, ...

Micron Technology, Inc. today announced a major milestone in memory innovation with the successful demonstration of the world's first 512GB DDR5 module on multiple server platforms.