Testing co-packaged optics and silicon photonics is simplified with FormFactor’s Pharos Optical Probe Series, offering low-loss coupling and patented fiducial technology.

AI may accelerate semiconductor design, but users still need formal proof, semantic continuity, and auditable workflows to trust automation.

Intel Malaysia is expanding advanced packaging capabilities in Penang as AI chips require more complex assembly, testing, and more.

Grid Dynamics joins NVIDIA, EAIGG, and BGV as co-hosts of the invite-only Physical AI Summit, bringing together leaders from enterprises, Physical AI startups, and investors on September 24, 2026, at ...

When you hear the term "industrial machinery," what comes to mind?Giant robotic arms. Conveyor belts. Machine tools. Pumps.

The global Furniture Flat-Pack Protection Market is projected to reach USD 509.8 million by 2036, up from USD 313.0 million in 2026, advancing at a 5.0% CAGR over the forecast period. Growth is being ...

The new system uses 14 autonomous shuttles to store and retrieve goods across 23 storeys of racks. Read more at straitstimes.com.

AI, robotics and connected systems are reshaping packaging automation, helping manufacturers improve flexibility, quality and uptime.

Visual Inspection Cockpit used in high-speed manufacturing, where products consist of delicate, textured materials that ...

The Tekpak QC-Sleever inspects, verifies, picks and packages patches at the client’s site at up to 1,600 patches a minute ...

In security operations centers where false moves carry severe consequences, engineers are building the observability and guardrail systems required to turn experimental machine learning into ...