Grove brought a similar message of peace and love to the mainland Chinese, telling a Shanghai audience: “There is a spirit of entrepreneuralism here which is as alive as in the United States.” He ...

Google’s Project Suncatcher is scheduled to send its first prototype satellite into orbit next week, to evaluate how Google ...

At Embedded World North America the wireless specialist Quectel has announced its QSM603FCP, a “smart PCBA” for edge computing that supports Android and Linux systems. It runs on MediaTek’s ...

CSignum, a startup for wireless IoT communications from beneath the surface, has completed a £2.6 million funding round. This ...

Terafab is either a massive chip fab being built by Elon Musk in Texas or a desk-top photolithography tool for prototyping ...

The UK has added 16 unicorns so far this year taking the country’s current total to 100 unicorns with 91 reaching unicorn status since 2017, according to Tracxn Technologies. This year has been the ...

In the Nanometer Stakes, the comparative  yield count on 2nm seems to be TSMC on 90%, Intel on 85% and Samsung on 70%. On 2nm wafer output, Intel is on around 30k wpm from Fab 52 and Hillsboro D1X  – ...

Bel Fuse has announced the XRCM200 and XRCM300 series of compact, high-density DC-DC converters for railway and transportation applications. The parts support input voltages from 16.8 VDC to 137.5 VDC ...

Lattice Semiconductor is releasing the Lattice Mach-N2 FPGA family, for system control and security in modern infrastructure. Mach-N2 combines integrated flash, a hardware Root of Trust, and CNSA ...

Univity has announced the success of uniSpark, its first in-orbit technology demonstration mission and claims it as a world’s first, paving the way for new spectrum resources for satellite ...

Japan’s Ministry of Internal Affairs and Communications has put up $44 million to support projects to make compact, ...

YMTC has won a battle with Micron in a German court for the infringement of two patents and has been awarded injunctions protecting its IP for ten years.. The disputed patents related to 3D NAND ...