Glass substrate adoption by major tech players may be closer than expected. KIPOST reports that NVIDIA has asked substrate ...

As interest from external customers in Intel’s EMIB (Embedded Multi-die Interconnect Bridge) continues to grow, substrate ...

China’s semiconductor sector delivered record first-half results in 2026, fueled by a memory upcycle, growing AI computing ...

As Qualcomm’s Snapdragon Summit kicks off on September 22, Samsung is marking a mobile memory milestone of its own. The company says it has become ...

A German court has issued two injunctions against Micron after finding that the company infringed YMTC patents related to 3D NAND technology.

According to TrendForce’s latest memory spot price trend report, DRAM spot buying remained cautious this week, with prices diverging by product. DDR4 ...

Alibaba is accelerating its push into AI infrastructure with new in-house chips. According to ijiwei, Alibaba’s T-Head has ...

The rise of personal AI agents could change the computing requirements behind AI workloads. According to Wccftech, personal ...

As TSMC prepares for A16 risk production in late 2026, its next-generation A14 node is reportedly running ahead of schedule.

Intel has recently disclosed a patent originally filed in 2022, revealing an IC packaging architecture that integrates Micro ...

Fresh off announcing LPDDR6 mass production and its debut in Xiaomi’s 18 Fold, CXMT has reached another major milestone.

Tesla’s next-gen Optimus may be moving closer to mass production, with Chinese suppliers set to play a key role. According to 21st Century Business ...