Wafer-to-wafer hybrid bonding process capable of achieving a 200-nanometre copper interconnect pitch demonstrated.

Silicon Motion Technology has introduced the SM2524XT, a new PCIe Gen5 DRAMless SSD controller designed to support the ...

Arm proposes a remuneration plan for its CEO, René Haas, that could see him earn more than $1bn if targets are reached.

Nexeon has announced that it has secured strategic investment from Honda to support battery material development.

Cirrus Logic has introduced a new family of nine audio converter devices aimed at expanding its audio offering.

AI has become a central element of Cadence Design Systems’ broader ‘Intelligent System Design’ strategy, as NE discovers ...

Siemens Digital Industries Software and Samsung Foundry have extended their collaboration to support advanced semiconductor design and manufacturing, with a focus on improving workflows for the global ...

Space is not kind to electronics. Solar irradiation makes even cooling a challenge. Then add the constant bombardment of high ...

Diodes has introduced the APK43070Q, a highly integrated device combining a synchronous buck controller with a USB Type-C ...

High-end computing is gradually embracing photonics for interconnect. But energy and maintenance remain big hurdles.

The company is introducing a new 1300 V silicon carbide (SiC) module within the HybridPACK Drive family capable of continuous operation at temperatures up to 205°C - existing designs typically allow ...

A collaboration between 42 Technology (42T) and Omnisense has seen the development of a new autonomous drone landing system ...