Startup Mitra brings Indian semiconductor startups and investors together as funding needs extend beyond the seed stage.

TSMC shares updates about the Open Innovation Platform Ecosystem and vision for enabling AI-driven agentic workflows using ...

Startup Delos Data unveiled its Apollo data interface chiplet at the AI Infra Summit, alongside $100M in funding to bridge heterogeneous AI hardware.

IBM’s quantum-centric supercomputing integrates QPUs with CPUs and GPUs into heterogeneous workflows, redefining the future of computing.

India moves five chip packaging plants into production as $13.5 billion ISM 2.0 expands manufacturing, design, and engineering capabilities.

Modern building automation systems are designed to optimize energy efficiency while safeguarding the health and safety of ...

Global semiconductor bottlenecks, multi-year foundry lead times, and rising trade friction leave European compute ...

More-electric aircraft (MEA) systems are transforming aerospace design by replacing complex hydraulics with advanced electric ...

GUC has announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs. Read more!

AI tools compress PCB design timelines from months to hours, enabling faster iteration cycles and letting engineers focus on innovation.

Scaling VLA robotics requires optimized inference, heterogeneous compute and real-time control on edge hardware.

AnalogPAK turns the analog front end into a configurable, reusable design: one PCB supports multiple sensors and ranges with no board re-spin.