Alibaba is accelerating its push into AI infrastructure with new in-house chips. According to ijiwei, Alibaba’s T-Head has ...

The rise of personal AI agents could change the computing requirements behind AI workloads. According to Wccftech, personal ...

As TSMC prepares for A16 risk production in late 2026, its next-generation A14 node is reportedly running ahead of schedule.

Intel has recently disclosed a patent originally filed in 2022, revealing an IC packaging architecture that integrates Micro ...

AI demand is showing little sign of slowing over the next couple of years. NVIDIA CEO Jensen Huang, according to CNBC, expects chip sales to double ...

The AI packaging boom is reshaping South Korea’s HBM export flows, with Malaysia taking on a growing role. According to Chosun Biz, South Korea’s ...

Fresh off announcing LPDDR6 mass production and its debut in Xiaomi’s 18 Fold, CXMT has reached another major milestone.

As AI demand drives growth in advanced packaging, TSMC is strengthening equipment and materials validation across its supply ...

Tesla’s next-gen Optimus may be moving closer to mass production, with Chinese suppliers set to play a key role. According to 21st Century Business ...

SK hynix may manufacture memory chips in the U.S. for the first time, potentially with an unexpected U.S. partner. According ...

Huawei has unveiled an accelerated roadmap for its next-generation AI chips at Huawei Connect 2026 in Shanghai. Citing ...

As Huawei draws attention with its new Kirin 9050 Pro featuring LogicFolding, a startup founded by one of its former chip ...