AMD reportedly preparing to raise prices on several of its product lines by around 10% from the fourth quarter of 2026.

Today, however, it plays a far more significant role. As technologies such as the Internet of Things (IoT), edge computing, artificial intelligence and industrial automation become increasingly ...

Bel Fuse has introduced the latest generation of its XRCM Series DC-DC converters, aimed at railway and transportation applications that require compact, high-density power solutions capable of ...

Both Qualcomm Technologies and PickNik are founding members of the Open Source Robotics Alliance (OSRA). Qualcomm said it plans to continue supporting major open-source robotics projects, including ...

Siemens and TSMC have expanded their collaboration on artificial intelligence-powered semiconductor design technologies.

IC-Link by imec and TSMC offer easier access to advanced chip design technologies and cloud-based design infrastructure.

The new VersaBeam Mini connector is a 16-fibre Expanded Beam Optical (EBO) interconnect that combines expanded beam technology with a very small form factor. According to the company, the design is ...

Nexperia and Tata form partnership covering semiconductor manufacturing, assembly and testing, technology collaboration.

French infrared imaging specialist LYNRED has introduced CAPT640, a new thermal imaging sensor designed for automotive applications, marking what the company describes as Europe’s first thermal ...

Imec has introduced a new germanium-silicon (Ge/Si) avalanche photodiode (APD) capable of combining 100GHz bandwidth, 5V operating voltage and a responsivity of 1.8A/W across both O- and C-band ...

BrainChip has launched a new PCIe development card designed to make its neuromorphic AI technology more accessible.

TUSK IC raises €15m in a funding round to accelerate the commercialisation of its satellite communications technology.