Cognex's In-Sight 1750 wafer and panel identification system helps chip makers reduce disruptions, improve traceability, and ...

Singapore semiconductor sector expands early education, industry exposure and regional exchanges to develop future technical ...

Continuous edge AI workloads are pushing thermal limits, making advanced microcooling critical for sustained performance in ...

Cadence's new RTL generation agent automates specification-to-code workflows, targeting early power, performance, and area ...

Rising prices and concentrated shipments from DRAM module makers in the second half of the year helped drive the industry's ...

AI glasses shipments surged 263% in 1H 2026, with display-less models accounting for 96% of the global market.

Singapore-based Nexstrom will use new funding to scale wafer-level 2D material growth for advanced semiconductor manufacturing.

Besxar's first space mission tests vacuum-enabled wafer processing, laying groundwork for autonomous compound semiconductor ...

PATEO and Arm will explore automotive physical AI workloads spanning perception, interaction, and intelligent vehicle control.

Lattice's Mach-N2 combines higher logic density, integrated flash and post-quantum cryptography for secure system control.

Global Unichip Corp.’s (GUC) design-ready HBM4E PHY and Controller IP has been adopted in customer AI ASICs. Implemented on ...

NOR Flash prices are set to diverge sharply in 2H26 as AI demand strains supply, with high-capacity products facing increases ...