Designing ICs on 0.13-micron and smaller process technologies poses tremendous challenges. The number of silicon failures caused by signal integrity problems is on the rise because existing design ...
PCB design guidelines are created as benchmarks for circuit design engineers to meet the industry standards. Following these guidelines will ensure better manufacturability and robust product ...
In today’s ever-shrinking IC package design cycles, it is almost imperative that we catch and correct routing issues as early as possible, which makes simulation an integral part of the design cycle.
January 10, 2024 -- Global Unichip Corporation (GUC), a leading global ASIC provider, has successfully taped out a complex 3D stacked die design on an advanced FinFET node process. The design, which ...
Santa Rosa, CA. Keysight Technologies Inc. has announced the launch of two electromagnetic (EM) software solutions designed to help signal-integrity (SI) and power-integrity (PI) engineers improve ...
In today’s complex system-on-chip (SoC) design flows, intellectual property (IP) blocks are everywhere—licensed from third parties, leveraged from internal libraries, or hand-crafted by expert teams.
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