Eindhoven-based TNO and BE Semiconductor Industries NV (Besi) are developing a production die bonder for the 3-D chip stacking market, with the first prototype expected to be ready by the second half ...
The Besi Datacon 8800 CHAMEO ultra plus is an advanced room temperature hybrid bonding system. It cost-effectively addresses increased demands for performance, speed, accuracy, and warpage control in ...
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